Osaka Fuji Industrial's slicing processing technology
We actively perform wire saw processing on various materials. We also accommodate short delivery times for mass production and small lot prototype processing.
Our company undertakes slicing processing (cutting processing) for various materials, including silicon wafers for solar cells. Utilizing various equipment, including multi-wire saws, we actively respond to customer needs for "processing expensive materials efficiently with minimal kerf loss," ranging from continuous production for mass production to lot production and individual production for research and development. If you are struggling with the costs or yield of cutting processing in your manufacturing or development operations, please feel free to consult Osaka Fuji Industry.
- Company：大阪富士工業
- Price：Other
